Copper GPU Water Cooling Block GPU Waterblock for MSI RTX 5090 D Ventus 3X OC 32G, for MSI RTX 5090 D Ventus 3X 32G

Compatibility: MSI RTX 5090 D Ventus 3X OC 32G Compatibility: MSI RTX 5090 D Ventus 3X 32G Compatibility: INNO3D GeForce RTX 5090 D X3 Compatibility: INNO3D GeForce RTX 5090 iChill Frostbite Compatibility: INNO3D GeForce RTX 5090 iChill X 3 Compatibility: INNO3D GeForce RTX 5090 X 3 OC Tips: 1. Please double check the graphics card detail model to ensure compatibility. Please feel free to contact us if you are not very sure. 2. Prohibit the use of alcohol containing coolant. 3. Graphics card block installation requires a certain skill and experience, because the graphics card manufacturing tolerances may have a certain impact on the block installation, we can assist buyers to solve such problems, but this can not be the basis of returns. Product parameters: Screw thread:G1/4'' Color:Transparent Size:Reference size chart Material:Aluminum/Copper/Arcyic Process:Plating/Polishing Before buying, please refer to the third picture to compare with the buyer’s graphics card PCB to avoid buying errors, or contact the seller. Product List: GPU LED WaterBlock*1 Thermal pads*1 LED light control line*1 Water caps*2

• (1).0.33mm jet micro water channel increases the heat absorption area, with up to 44 water channels. The copper plate length is extended to 158.451mm, increasing the water flow coverage area and providing powerful heat dissipation performance.
• (2).Matte finish texture craftsmanship, using high-quality materials, with upper and lower sandwich installation, providing all-round protection.
• (3).Reduce the weight of GPU BLOCK, protect PCB from deformation, and use chemical nickel plating surface treatment process to effectively prevent corrosion and erosion.
• (4).6MM design, sufficient materials, using single-layer sealing ring design, effectively reducing the risk of liquid leakage.
• (5).While ensuring the ability to withstand installation pressure, a copper base thickness of 0.35mm is used to effectively reduce the thermal resistance of the copper plate and improve thermal conductivity efficiency.